Dow Corning joins Imec to advance 3D integrated circuit packaging
ERJ staff report (BC)
San Francisco – Dow Corning, which calims leading status silicones and silicon-based technology, has joined Imec, a nano-electronics R&D centre.
By integrating multiple chips into a single package, 3D integrated circuit (IC) technology is intended to reduce form factor and power consumption, increasing bandwidth to enable more efficient inter-chip communication for "next generation" microelectronic devices. Broader adoption of 3D IC fabrication will require advances in materials and processing technologies, says Dow.
Andrew Ho, global industry director for advanced semiconductor materials at Dow Corning, said: “Our access to imec’s world-class resources and expertise will not only help us further refine our unique temporary bonding solution, it will allow imec to leverage that solution to advance integration of the 3D IC packaging process that they’ve been developing for years.”
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