ERJ staff report (LMH)
Frankfurt, Germany -- Dow Automotive Systems will show two new bonding agents at the DKT exhibition in Nuremberg, Germany, 2-5 July.
Megum 5386 is a new two layer bonding agent (Cover II) and is characterised by high reactivity for reduced thickness of layers, Dow said. Layer thickness can be cut back to 50 percent.
Dow said that with this new development it reduces solvent-based emissions and mould fouling. On top, it provides for increased process stability. Megum 5386 is produced in Germany and will available in September 2012. It is targeted for use in automotive NVH (noise-vibration-harshness) applications.
In addition to Megum 5386, Dow will show its latest development for water-based bonding agents, Megum W1111 which will support the complete elimination of solvent-based emissions.
Dr. Philipp Zutavern, TS&D Manager, Dow Automotive Systems, will present a paper during the poster session on water-based rubber-to-substrate bonding agents.
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Website of Dow Automotive Systems