Midland, Michigan -- Dow Corning Corp. is to offer a technical seminar about the use of silanes in filled polymers at the 2005 International Conference on Interfaces & Interphases in Multicomponent Materials (IIMM) in Lyon-Villeurbanne, France. The date is 14 September, 2005.
The company said Laurence Stélandre, a filler senior specialist with Dow Corning's Surface & Interface Solutions Center (SISC) in Belgium, will present The paper, Impact of the silane on the dispersion and performance of polymer filled with sub-micronic fillers,â€