Tokyo – Zeon Corp. has developed a rubber-based thermal interface material (TIM) pad that offers a significant advance in cooling technology of computing devices, the company announced 10 Dec.
The heat-dissipation materials incorporate super-growth carbon nanotubes (SGCNTs) and are said to offer higher operability and reliability compared to conventional thermal grease.
According to Zeon, the development follows the start of operations at an SGCNT mass production plant in November 2015.
Zeon is also constructing a pilot plant for mass production of the new TIM. The facility is scheduled…